| 2009 |
|
| May. 2009 |
SiS 217H HDTV Processor Eyes for Taiwan HiHD DVB-T Market. |
| Apr. 2009 |
SiS Announces Multi-Touch Panel Control Processor --- SiS810. |
| Mar. 2009 |
SiS Announces SiS329 HDTV Processor for Pan European market. |
| Feb. 2009 |
SiS Group Company– LinkVast Releases New SSD Memory Controllers --- LVT820/815. |
| 2008 |
|
| Nov. 2008 |
Introducing SiSM671-Based chipset in DELL FX160 Thin-Client PC for Business DT Computer best choice. |
| Jun. 2008 |
SiS Shareholder Meeting agree spin-off 2 consumer related IC design houses. |
| Mar. 2008 |
Announces join to design the consumer related product. |
| 2007 |
|
| Sep. 2007 |
SiS to Actively Participate in Intel Developer Forum in San Francisco. |
| Aug. 2007 |
SiS671-based PCs from Tsinghua Tongfang to be Presented to the Market. |
| Jul. 2007 |
SiS unveiled the world’s first reference board in mini DTX form factor for home server named “Churchill”. |
| Mar. 2007 |
SiS Presents Full Line of Windows Vista Ready Chipsets to Grab Your Attention at CeBIT 2007. |
| Feb. 2007 |
SiS671FX and SiS671 are ready for Windows Vista. |
| Jan. 2007 |
Announces setting up the ChongQing, China and Fremont, CA USA R&D Offices. |
| 2006 |
|
| Nov. 2006 |
SiS announced the newly-released SiS671FX integrated chipset, supports Intel Core™ 2 Duo and Microsoft Windows Vista. |
| Aug. 2006 |
SiS create competitive advantage of DRAM with CDFN packaging |
| Apr. 2006 |
SiS hold a seminar in Seoul, Korea to promote multiple embedded solutions to the Korean market. |
| Mar. 2006 |
SiS releases new SiS662 Northbridge chipsets, team up with Intel P4 platform. |
| Feb. 2006 |
Announces setting up a Module Division. |
| 2005 |
|
| Nov. 2005 |
Announces SiS multimedia chipset in Xbox 360, entering consuming electronics market. |
| Aug. 2005 |
SiS announces Mobile Chipset License Agreement on Intel® Pentium® M FSB 533MHz. |
| May. 2005 |
SiS announces investment in VXIS Technology Corp., entering the consumer electronics market. |
| Feb. 2005 |
SiS Announces Chipset License Agreement on Intel® Pentium® 4 FSB 1066MHz. |
| 2004 |
|
| Oct. 2004 |
Announced the new single channel chipset for Intel Pentium® 4 platform, SiS649, with support of PCI Express interface, and DDR2-533. |
| Mar. 2004 |
Announced that Board of Directors has named Mr. Daniel Chen to replace Michael Chen as President & CEO of SiS. |
| Mar. 2004 |
Announced SiS163, the SiS' first WLAN chipset with support of IEEE 802.11g. |
| Mar. 2004 |
Announced the SiS' first chipset for Intel Pentium® 4 platform, SiS656, with support of PCI Express interface and new generation DDR2-667 memory module. |
| Feb. 2004 |
Announced the newest south bridge chipset, the SiS965, supporting PCI Express and integrated Gigabit LAN and featuring support for up to 4 SATA ports. |
| Jan. 2004 |
Announced new southbridge chipset, SiS965L, the first core logic chipset of SiS with support of PCI Express. |
| 2003 |
|
| Nov. 2003 |
Announced a agreement with Microsoft for developing advanced media I/O chipset for next generation Xbox® product. |
| Oct. 2003 |
Announced SiS150, the worldwide Fastest, Thinnest, Low-power USB 2.0 Flash Disk Controller with Dual-Channel enabled. |
| Oct. 2003 |
Announced new chipset for Intel Pentium® 4 platform SiS655TX, with support of FSB800MH, dual-channel, and SiS proprietary Advanced HyperStreaming™ Technology. |
| Apr. 2003 |
Announced to extend the long-term chipset license agreement with Intel on FSB 800MHz. |
| Mar. 2003 |
Announced the first generation WLAN chip—SiS160. |
| Mar. 2003 |
Announced the new higher performance, lower voltage system on-a-chip, the SiS55x LV. |
| Jan. 2003 |
The board of directors has appointed Mr. John Hsuan, the Vice Chairman of UMC as the new Chairman of SiS, and Mr. Michael Chen, the senior vice president as the Acting President of SiS. |
| 2002 |
|
| Nov. 2002 |
Announced the new chipset for Pentium® 4—SiS655, with worldwide first support of Dual Channel DDR333 memory. |
| Oct. 2002 |
Opened the Beijing office to officially deploy into mainland China market. |
| Jul. 2002 |
Announced the new chipset for Pentium 4--SiSR658, with worldwide first support of 4i and 16dx2 Dual Channel RDRAM. |
| Apr. 2002 |
Announced the new graphics family--Xabre, with worldwide first support of AGP8X and Direct X 8.1. |
| Mar. 2002 |
SiS makes a splash at Cebit 2002 Computer Show and launch worldwide first solutions of DDR400 and AGP8X products. |
| Mar. 2002 |
Announced the new south bridge chip with integration of high-performance USB2.0 host Controller--SiS962. |
| Mar. 2002 |
Announced the new generation chipset for Pentium 4--SiS645DX. |
| 2001 |
|
| Nov. 2001 |
SiS announces the signing of a technology license agreement with Toshiba Corporation, including the access to Toshiba's advanced CMOS logice process. |
| Oct. 2001 |
Introduced SiS550, the SoC enabler with integrated CPU, core logic, graphics and connectivity. |
| Sep. 2001 |
Introduced SiS650, the world's first Pentium®4 chipset with integrated 256-bit 2D/3D graphics. |
| Aug. 2001 |
Introduced SiS645, the world's first Pentium® 4 chipset supporting DDR333 and SiS proprietary MuTIOL® technology |
| Aug. 2001 |
SiS licences ARM core for PC logic applications. |
| Jun. 2001 |
SiS315 3D graphics chip was awarded "Best of COMPUTEX 2001" by Nikkei BYTE. |
| Mar. 2001 |
Announced patent cross-licensing agreement with Intel, which allow SiS to sell chipsets that are compatible with Pentium® 4 processor bus. |
| Mar. 2001 |
Announced patent cross-licensing agreement with IBM, including design and process related patents. |
| Feb. 2001 |
Introduced SiS635T, the world's first mass-production solution to support Intel® Tualatin CPU. |
| 2000 |
|
| Dec. 2000 |
Hosted a groundbreaking ceremony for the first 12-inch wafer fab plant and R&D complex in Tainan Science-based Industrial Park. |
| Dec. 2000 |
Introduced SiS315, a 256-byte 3D graphics chip supporting high-performance T&L. |
| Oct. 2000 |
Successfully developed the world's first operating platform running Linux BIOS with SiS630. |
| Mar. 2000 |
8-inch wafer fab plant successfully completed pilot production of the first SiS630 chip. |
| 1999 |
|
| Dec. 1999 |
Our SiS630 and SiS300 were awarded the 8th Annual "Excellent Product of Taiwan Award". |
| Dec. 1999 |
Our SiS630 was awarded the "Innovative Product Prize of the Science-based Industrial Park" and the "Best Component Design Award" by EDN Asia Magazine. |
| Oct. 1999 |
Announced the attainment of a microprocessor-technology transfer from U.S.-based RISE. |
| May. 1999 |
Introduced SiS630, the world's first Intel® Pentium® III single chip with integrating core logic, 3D graphics and network. |
| Apr. 1999 |
Introduced SiS300, a 3D / DVD / TV-OUT / LCD-OUT graphics chip. |
| Apr. 1999 |
Announced construction of an 8-inch wafer fab plant, expected to begin production in 2000. |
| 1998 |
|
| Dec. 1998 |
Awarded the 1998 "Science-based Industrial Park's Dedication to R&D Prize" and the "Excellent Product of Taiwan Award". |
| Nov. 1998 |
Awar d the "Corporation Outstanding in the Development of New Products" prize by the Ministry of Economic Affairs.de |
| Nov. 1998 |
Introduced SiS900 ACPI Wake-On-LAN PCI Fast-Ethernet 10 / 100 Mb three-in-one chip. |
| Sep. 1998 |
Introduced SiS620, a SOC integrating graphics function core logic and the world's first to offer Celeron & Pentium II-compliant and 3D graphics features. |
| Aug. 1998 |
Introduced SiS530, a SOC integrating 3D graphics function into core logic, and the first of its kind to offer Socket 7-compliant and 3D graphics features. |
| Jun. 1998 |
At a shareholders' meeting, conversion of profits into a NT$ 509.4 million recapitalization was approved, which eventually contributed to a paid-in capital of NT$ 3,663 million in total. |
| Jun. 1998 |
Introduced SiS6326 AGP, a highly-compatible, three-in-one graphics acceleration chip featuring 2D & 3D acceleration virtual engines, AGP interface and the best price/function ratio among 3D graphics chips. |
| Apr. 1998 |
Introduced SiS6326 DVD, which offered the world's first DVD with well-rounded features by integrating Macro-Vision into the SiS6326. |
| 1997 |
|
| Dec. 1997 |
Our SiS6326 AGP / PCI 3D graphics-video acceleration chip was awarded the 1997 "Innovative Product Prize of the Science-based Industrial Park". |
| Aug. 1997 |
Officially launched a public share offering on the Taiwan Stock Exchange Corp. |
| Jun. 1997 |
Introduced SiS6326, a highly-compatible, five-in-one graphics acceleration chip featuring 2D & 3D acceleration virtual engines, DVD decoder, TV coder and AGP interface. |
| Apr. 1997 |
Introduced SiS5598, a system-on-a-chip (SOC) integrating graphics features into core logic, the first of its kind in the world. |
| Apr. 1997 |
At a shareholders' meeting, conversion of profits into a NT$ 5.684 million recapitalization was approved, which eventually contributed to a paid-in capital of NT$ 3,153.4 million in total. |
| Jan. 1997 |
Honored with the 1996 "Ministry of Economic Affairs Excellent Technology Development Distinction Award". |
| 1996 |
|
| Dec. 1996 |
Awarded the 1996 "Science-based Industrial Park's Dedication to R&D Prize" |
| Dec. 1996 |
Our single chipset SiS5571 was awarded the 1996 "Innovative Product Prize of the Science-based Industrial Park". |
| Jun. 1996 |
Introduced a SiS5110 Pentium Notebook Chipset, the first of its kind in the world that integrated LCD, graphics chips and PCMCIA into a core-logic chipset. |
| Jun. 1996 |
At a regular shareholders' meeting, conversion of the fiscal-1994 profits into a NT$ 725 million recapitalization was approved, which eventually contributed to a pain-in capital of NT$ 2,585 million in total. |
| Jan. 1996 |
Launched a new plant in Hsinchu. With an area covering 25,562.66 square meters (including a 2-story basement), the construction was a complex designed for the R&D and testing of products, as well as an office building with facilities for parking, dining and recreational activities for staff. |
| 1995 |
|
| Dec. 1995 |
Awarded the 1995 "Science-based Industrial Park's Dedication to R&D Prize" and "First Runner-up for Productivity (Design Category) of the Science-based Industrial Park". |
| Jun. 1995 |
At a regular shareholders' meeting, conversion of the fiscal-1994 profits into a NT$ 360 million recapitalization was approved, which eventually contributed to a paid-in capital of NT$ 1,860 million in total. |
| Jan. 1995 |
Invested in the establishment of a HK-based subsidiary of SiS. |
| 1994 |
|
| Nov. 1994 |
The Security Administration Committee of MOF approved an issuance of NT$ 650 million share rights, which eventually contributed to a paid-in capital of NT$ 1,500 million in total. |
| 1993 |
|
| Nov. 1993 |
Honored with the 2nd Annual "Excellent Industrial Technology Merit" by the Chinese Association for Industrial Technology Advancement (CAITA). |
| 1992 |
|
| Dec. 1992 |
Invested in the establishment of a U.S.-based subsidiary of Silicon Integrated Systems Corporation (SiS). |
| 1991 |
|
| Dec. 1991 |
Awarded the "Dedication to Technological R&D" prize by the Park's Administration. |
| Nov. 1991 |
The Security Administration Committee of the Ministry of Finance (MOF) approved an issuance of NT$ 650 million share rights, which eventually contributed to a paid-in capital of NT$ 850 million in total. |
| 1990 |
|
| May. 1990 |
Introduced a high-performance 386 (33 MHZ) chipset featuring cache memory circuits through state-of-the-art ASIC design and manufacturing technology. Thanks to that chipset, we were awarded the "Innovative Product Sponsorship" by the Park's Administration. |
| 1989 |
|
| Apr. 1989 |
The Board approved an issue of NT$ 75 million share rights, turning profits into a recapitalization of NT$ 60 million. The company's registered and paid-in capital reached NT$ 200 million in total. |
| 1988 |
|
| Oct. 1988 |
Outpaced local counterparts through successful development of 1M Mask ROM, which was recommended by the Park's Administration as an innovative product of the year. |
| 1987 |
|
| Oct. 1987 |
Moved to Hsinchu Science-based Industrial Park. Operations began one month later. |
| Aug. 1987 |
Company officially registered with a capital of NT$ 65 million. |
| Feb. 1987 |
Preparation office founded. Hsinchu Science-based Industrial Park Committee approved investment project in June. |
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